Measurement of Soldering Paste in SMD Soldering Systems by Laser Distance Sensors Triangulation
In reflow soldering, soldering paste is applied through the openings of a template to the intended contact surfaces of a PCB using a scraper. During this process, the height of the solder paste between the two scrapers must be continuously monitored. To measure the paste height, laser distance sensors triangulation are used to precisely measure the current height of the solder paste and automatically regulate the redosing. If the paste level drops below a defined threshold value, solder paste is automatically added. This ensures an even flow of material.
Laser Distance Sensors Triangulation
The contactless laser triangulation sensors work according to the angle measurement principle, which enables reliable and highly precise measurement in the close range up to 1,000 mm. The triangulation sensors deliver stable measured values regardless of colors, shapes, rough and textured surfaces.
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