Bin Picking with Metal Components via 3D Sensors
Bin picking refers to an automation process where chaotically arranged objects are detected, picked and conveyed using 3D sensors and robots. Installed stationary above the container, the sensor first creates a point cloud using structured light. This creates a three-dimensional model of the surface. With this information and thanks to high point densities, the robots can detect and reliably grip surfaces, openings or grooves of even the smallest components.
3D sensors perform three-dimensional completeness, dimensional accuracy and surface checks. They enable the control of robots, for example in pick-and-place or bin picking applications. 3D sensors project structured light patterns that are recorded and digitized as 3D point clouds using a camera.