Measuring the Bending of PCBs via Laser Distance Sensor Triangulation in Soldering Systems
In the electronics industry, PCBs are fixed and conveyed laterally in transport modules, which can lead to bending. In order for the solder robot to compensate for this bend and create the ideal distance between the plate and the solder head, the bending of the PCBs must be measured. A laser distance sensor triangulation is installed for this purpose, which measures several points on the board from below. The control system uses the measured values to create a profile. The sensor measures precisely despite different colors and shiny solder pads and thus enables a reliable soldering process.
Laser Distance Sensors Triangulation
The contactless laser triangulation sensors work according to the angle measurement principle, which enables reliable and highly precise measurement in the close range up to 1,000 mm. The triangulation sensors deliver stable measured values regardless of colors, shapes, rough and textured surfaces.
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